Model:GMSV36-01-D 91/096D/E
Technology:Advanced 3D Measurement
Measurement Range:0.01 – 36 mm
Resolution:Sub-micron accuracy
Operating Temperature:-10°C to 50°C
Humidity:5% to 95% non-condensing
Power Consumption:Less than 1 kW
Dimensions:3600mm (L) x 900mm (W) x 1500mm (H)
Engineered for precision: The GMSV36-01-D 91/096D/E is meticulously designed to handle a variety of semiconductor materials with unparalleled accuracy, ensuring consistent results across multiple production runs.
Efficient thermal management: Advanced cooling systems maintain optimal temperature levels, preventing overheating during prolonged operations, thus extending the tool’s lifespan and reducing maintenance downtime.
Versatile process capabilities: This tool supports a wide range of deposition and etching techniques, accommodating diverse semiconductor fabrication needs and enabling flexibility in production.
Intelligent control system: Incorporating state-of-the-art automation and monitoring technologies, the system ensures real-time process control and immediate adjustments to optimize output quality.
Ease of integration: Designed with modular architecture, the GMSV36-01-D 91/096D/E can be easily integrated into existing production lines, minimizing installation time and maximizing operational efficiency.
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