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YASKAWA SGDV-170D11A | Advanced Mechatrolink-II Communications Module

The Yaskawa SGDV-170D11A Mechatrolink-II Communications Module is designed for seamless integration into industrial automation systems, enabling efficient data exchange between devices.

Type:Communications Module

Model Number:SGDV-170D11A

Mechatrolink-II Compatibility:Yes

Data Transfer Rate:Up to 10 Mbps

Operating Voltage:DC 24V

Current Consumption:Max. 20mA

Communication Channels:1

Connection Type:RS-485

Temperature Range:-10°C to +50°C

Protection Class:IP20

Dimensions (WxHxD):80mm x 46mm x 27.8mm

Weight:0.03kg

    The Yaskawa SGDV-170D11A is engineered to deliver exceptional performance and reliability in industrial automation environments. This module is meticulously designed for compatibility with Yaskawa’s extensive range of drives and controllers, ensuring seamless integration and enhanced system capabilities.

    Equipped with advanced MECHATROLINK-II technology, it supports RS-485 communication protocols, enabling high-speed data transfer rates up to 1Mbps, which significantly improves operational efficiency and reduces latency in industrial networks.

    With its low power consumption of less than 1W, the SGDV-170D11A optimizes energy usage without compromising on performance, making it an ideal choice for resource-sensitive applications. Its operating temperature range of -20°C to +50°C ensures robust functionality across diverse environmental conditions.

    Compact and DIN rail mountable, this module offers flexible installation options, facilitating easy setup and maintenance. The Yaskawa SGDV-170D11A is not just a communications solution; it’s a strategic component that elevates the performance and connectivity of your industrial automation systems.

    Experience enhanced productivity, reduced downtime, and streamlined operations with the Yaskawa SGDV-170D11A MECHATROLINK-II Communications Module. Upgrade your system today and unlock new levels of efficiency and reliability.

YASKAWA SGDV-170D11A MECHATROLINK-II COMMUNICATIONS




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